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Domestic bonds: TSW Industries, 6% 19dec2023, EUR (IT0005354151)

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Senior Unsecured

Status
Matured
Amount
1,000,000 EUR
Placement
***
Redemption (put/call option)
*** (-)
ACI on
Country of risk
Italy
Current coupon
-
Price
-
Yield / Duration
-
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Calculate in two clicks! yield, duration and other parameters
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  • Placement amount
    1,000,000 EUR
  • Outstanding amount
    1,000,000 EUR
  • Face value
    100,000 EUR
  • ISIN
    IT0005354151
  • CFI
    DBVUBB
  • FIGI
    BBG00MZ3L9Y6
  • Ticker
    TSWIDS 6 12/19/23

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Issue information

Profile
W Industries is the leading edge company in chocolate moulding and packaging technology solutions, incorporating the world-renowned Tecnosweet and Hitech Systems brands. From distribution and feeding systems, flow wrapping, cartoning, loading and closing to case packing ...
W Industries is the leading edge company in chocolate moulding and packaging technology solutions, incorporating the world-renowned Tecnosweet and Hitech Systems brands. From distribution and feeding systems, flow wrapping, cartoning, loading and closing to case packing and ends fold wrapping, TSW’s solution based approach is gained from thousands of installations around the world.
  • Issuer
    Go to the issuer page
    TSW Industries
  • Full borrower / issuer name
    TSW Industries
  • Sector
    Corporate
  • Industry
    Other Sectors
Volume
  • Placement amount
    1,000,000 EUR
  • Outstanding amount
    1,000,000 EUR
Face value
  • Face value
    100,000 EUR
  • Outstanding face value
    *** EUR
  • Increment
    *** EUR

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Early redemption terms

***

explore the most comprehensive database

800 000

bonds globally

Over 400

pricing sources

80 000

stocks

9 000

ETF

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • The purpose of placing
    The issue is made to financially support the growth plan aimed at achieving consolidation in the reference market (machinery for flexible or rigid packaging, mainly for the confectionery sector), growth in other outlet markets (cosmetics, beauty care, beverage) and the development of new technological solutions applicable to the modeling and packaging activity (eg vertical packaging, casting). The plan provides for the use of resources for a total amount of 5,000,000 Euros. Investments are based on the following guidelines: * to extend the technological know-how to business segments judged to have high development potential, and in particular to the realization of machinery for the wrapping of chocolate-based products and packaging machines for solid and liquid products in flexible packages (sc. "doypack") * insertion of new human resources in the technical / design field (strengthening the technological know-how the Company makes available to its customers), commercial field (support the dimensional growth of the business, approach new customers in new industrial sectors, consolidate the Company's reputation on the international market), managerial / administrative field (adapt the organizational structure to the increased operational dimensions) * progressively develop after-sales service, assistance and maintenance activities alongside the core design business
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Additional information

Latest issues

Identifiers

  • ISIN
    IT0005354151
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBVUBB
  • FIGI
    BBG00MZ3L9Y6
  • Ticker
    TSWIDS 6 12/19/23
  • Type of security by CBR
    ***

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Bearer
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

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