Contact us (+ 7 (921) 446-25-10)
×
Texting is available for authorized users.
Please register or log in at the website.
×
Your request for online training is sent. Cbonds managers will be in touch with you shortly. Thank you!

New bond issue: Lai Fung Holdings Limited issued international bonds (XS1747539465) with a 5.65% coupon for USD 350.0m maturing in 2023

January 11, 2018 | Cbonds

January 10, 2018 Lai Fung Holdings Limited issued international bonds (XS1747539465) with a 5.65% for USD 350.0m maturing in 2023. Bonds were sold at a price of 100% with an initial yield of 5.65%. Bookrunner: DBS Bank, HSBC, OCBC, UBS. Depository: Euroclear Bank, Clearstream Banking S.A.


Emission: Lai Fung Holdings Limited, 5.65% 18jan2023, USD

StatusCountry of riskRedemption (offer)VolumeEmission Rating (M/S&P/F)
in corsoHong Kong18.01.2023350.000.000 USD-/-/BB-

Società: Lai Fung Holdings Limited

Full company nameLai Fung Holdings Limited
Country of riskHong Kong
Country of registrationCayman Islands
SettoreOther sectors

Condividere:

Similar news:
minimizeexpand
150 000
issues: local and international bonds
170
countries
+7 812 336 97 21
pro@cbonds.info
150 000
issues: local and international bonds
170
countries
Сbonds is a global Fixed income data platform
+7 812 336 97 21
pro@cbonds.info
Data
  • Descriptive data on bonds
  • Bond Quotes from trading systems and market participants
  • Prospectuses and other issue documents
  • Credit ratings
  • Indices and indicators
  • Market news and analytical research
Analytical instruments
  • Multi-parameter bond database search
  • Bond Maps
  • Market calendar
  • Bond calculator
  • Watchlist and Portfolio management
  • Chart analysis
  • Mobile App and Excel Add-in Tool
Enter or RegisterSubscription/Trial access
×